General information

Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number  ? 

CPU part numbers

• CM8063701211700 is an OEM/tray microprocessor

• CM8063701211701 is an OEM/tray microprocessor

• BX80637I73770K is a boxed processor with fan and heatsink (English version)

• BXC80637I73770K is a boxed processor with fan and heatsink (Chinese version)

Frequency ? 

3500 MHz

Maximum turbo frequency

3900 MHz (1 or 2 cores)
3800 MHz (3 cores)
3700 MHz (4 cores)

Low power frequency

1600 MHz

Bus speed ? 

5 GT/s DMI

Clock multiplier ? 

35

Package

1155-land Flip-Chip Land Grid Array

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Weight

1oz / 27.1g (CPU)
13.1oz / 372.6g (box)

Introduction date

April 23, 2012 (announcement)
April 29, 2012 (launch)

End-of-Life date

Last order date is December 26, 2014
Last shipment date is June 5, 2015

Price at introduction

$332 (OEM)
$342 (box)

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Processor core  ? 

Ivy Bridge

Core stepping  ? 

E1 (QC45, SR0PL)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size  ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Features

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• F16C / 16-bit Floating-Point conversion instructions

• EM64T / Extended Memory 64 technology / 64  ? 

• NX / XD / Execute disable bit  ? 

• HT / Hyper-Threading technology  ? 

• TBT 2.0 / Turbo Boost technology 2.0  ? 

• VT-x / Virtualization technology  ? 

Low power features

Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

GPU Type: HD 4000
Graphics tier: GT2
Microarchitecture: Gen 7
Execution units: 16
Base frequency (MHz): 650
Maximum frequency (MHz): 1150
The number of supported displays: 3

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6

Other peripherals

• Direct Media Interface 2.0

• PCI Express 3.0 interface

Electrical / Thermal parameters

Maximum operating temperature  ? 

67.4°C (case)
105°C (junction)

Thermal Design Power ? 

77 Watt