General information

Type

CPU / Microprocessor

Market segment

Server

Family

Model number  ? 

CPU part numbers

• CM8063501288843 is an OEM/tray microprocessor

• BX80635E52697V2 is a boxed microprocessor

Frequency ? 

2700 MHz

Maximum turbo frequency

3000 MHz (6 or more cores)
3100 MHz (5 cores)
3200 MHz (4 cores)
3300 MHz (3 cores)
3400 MHz (2 cores)
3500 MHz (1 core)

Bus speed ? 

8 GT/s QPI (4000 MHz)
5 GT/s DMI

Clock multiplier ? 

27

Package

2011-land Flip-Chip Land Grid Array

Socket

Socket 2011 / LGA2011

Size

2.07" x 2.01" / 5.25cm x 5.1cm

Introduction date

September 10, 2013

Price at introduction

$2614 (OEM)
$2618 (box)

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Platform

Romley-EP
Romley-WS

Processor core  ? 

Ivy Bridge-EP

Core steppings  ? 

C0 (QEEY)
C1 (QF93, SR19H)

CPUID

306E4 (QF93, SR19H)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

12

The number of threads

24

Floating Point Unit

Integrated

Level 1 cache size  ? 

12 x 32 KB 8-way set associative instruction caches
12 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

12 x 256 KB 8-way set associative caches

Level 3 cache size

30 MB 20-way set associative shared cache

Physical memory

768 GB (per socket)

Multiprocessing

Up to 2 processors

Features

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• F16C / 16-bit Floating-Point conversion instructions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• NX / XD / Execute disable bit  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0  ? 

• TXT / Trusted Execution technology

• HT / Hyper-Threading technology  ? 

Low power features

Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 4
Supported memory: DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600, DDR3-1866
DIMMs per channel: 3
Maximum memory bandwidth (GB/s): 59.7
ECC supported: Yes

Other peripherals

• Direct Media Interface 2.0

• Quick Path Interconnect (2 links)

• PCI Express 3.0 interface

Electrical / Thermal parameters

V core  ? 

0.65V - 1.3V

Minimum/Maximum operating temperature  ? 

5°C - 86°C

Thermal Design Power ? 

130 Watt