The specs can be used for short-term
listings on auction and classifieds sites
General information |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family | |
Model number ?
| |
CPU part numbers | BV80605001905AI is an OEM/tray microprocessor
BX80605I7870 is a boxed processor with fan and heatsink (English version)
BXC80605I7870 is a boxed processor with fan and heatsink (Chinese version)
|
Frequency ? | 2933 MHz |
Maximum turbo frequency | 3600 MHz (1 core) 3467 MHz (2 cores) 3200 MHz (3 or 4 cores) |
Bus speed ? | 2.5 GT/s DMI |
Clock multiplier ? | 22 |
Package | 1156-land Flip-Chip Land Grid Array (FC-LGA8) |
Socket | Socket 1156 / H1 / LGA1156 |
Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
Weight | 0.9oz / 24.8g |
Introduction date | Sep 8, 2009 |
End-of-Life date | Last order date is June 29, 2012 Last shipment date for tray processors is December 7, 2012 |
Price at introduction | $562 |
S-spec numbers |
Part number | ES/QS processors | Production processors |
| Q3AJ | SLBJG | BV80605001905AI | + | + | BX80605I7870 |
| + | BXC80605I7870 |
| + |
|
Architecture / Microarchitecture |
Microarchitecture | Nehalem |
Processor core ?
| Lynnfield |
Core stepping ?
| B1 (Q3AJ, SLBJG) |
CPUID | 106E5 (SLBJG) |
Manufacturing process | 0.045 micron 774 million transistors |
Die | 296mm2 |
Data width | 64 bit |
The number of CPU cores | 4 |
The number of threads | 8 |
Floating Point Unit | Integrated |
Level 1 cache size ?
| 4 x 32 KB 4-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
Level 2 cache size ? | 4 x 256 KB 8-way set associative caches |
Level 3 cache size | 8 MB 16-way set associative shared cache |
Physical memory | 16 GB |
Multiprocessing | Uniprocessor |
Extensions and Technologies | MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
EM64T / Extended Memory 64 technology / Intel 64 ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O NX / XD / Execute disable bit ?
TXT / Trusted Execution technology TBT / Turbo Boost technology ?
|
Low power features | Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology ?
|
Integrated peripherals / components |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3-1333 Maximum memory bandwidth (GB/s): 21.3 |
Other peripherals | |
Electrical / Thermal parameters |
V core ?
| 0.65V - 1.4V |
Minimum/Maximum operating temperature ?
| 5°C - 72.7°C |
Maximum power dissipation ?
| 189.78 Watt (peak) 160.08 Watt (sustained) |
Thermal Design Power ? | 95 Watt |
Notes on Intel Core i7-870 |
|
Intel Core i7-870 specifications
The specs can be used for short-term
listings on auction and classifieds sites
General information |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family | |
Model number ?
| |
CPU part numbers | BV80605001905AI is an OEM/tray microprocessor
BX80605I7870 is a boxed processor with fan and heatsink (English version)
BXC80605I7870 is a boxed processor with fan and heatsink (Chinese version)
|
Frequency ? | 2933 MHz |
Maximum turbo frequency | 3600 MHz (1 core) 3467 MHz (2 cores) 3200 MHz (3 or 4 cores) |
Bus speed ? | 2.5 GT/s DMI |
Clock multiplier ? | 22 |
Package | 1156-land Flip-Chip Land Grid Array (FC-LGA8) |
Socket | Socket 1156 / H1 / LGA1156 |
Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
Weight | 0.9oz / 24.8g |
Introduction date | Sep 8, 2009 |
End-of-Life date | Last order date is June 29, 2012 Last shipment date for tray processors is December 7, 2012 |
Price at introduction | $562 |
S-spec numbers |
Part number | ES/QS processors | Production processors |
| Q3AJ | SLBJG | BV80605001905AI | + | + | BX80605I7870 |
| + | BXC80605I7870 |
| + |
|
Architecture / Microarchitecture |
Microarchitecture | Nehalem |
Processor core ?
| Lynnfield |
Core stepping ?
| B1 (Q3AJ, SLBJG) |
CPUID | 106E5 (SLBJG) |
Manufacturing process | 0.045 micron 774 million transistors |
Die | 296mm2 |
Data width | 64 bit |
The number of CPU cores | 4 |
The number of threads | 8 |
Floating Point Unit | Integrated |
Level 1 cache size ?
| 4 x 32 KB 4-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
Level 2 cache size ? | 4 x 256 KB 8-way set associative caches |
Level 3 cache size | 8 MB 16-way set associative shared cache |
Physical memory | 16 GB |
Multiprocessing | Uniprocessor |
Extensions and Technologies | MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
EM64T / Extended Memory 64 technology / Intel 64 ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O NX / XD / Execute disable bit ?
TXT / Trusted Execution technology TBT / Turbo Boost technology ?
|
Low power features | Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology ?
|
Integrated peripherals / components |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1066, DDR3-1333 Maximum memory bandwidth (GB/s): 21.3 |
Other peripherals | |
Electrical / Thermal parameters |
V core ?
| 0.65V - 1.4V |
Minimum/Maximum operating temperature ?
| 5°C - 72.7°C |
Maximum power dissipation ?
| 189.78 Watt (peak) 160.08 Watt (sustained) |
Thermal Design Power ? | 95 Watt |
Notes on Intel Core i7-870 |
|
1. All the products are 100% original and tested before shippment.
2.When you have placed an order, we will give you shipment as soon as possible, within three days.
3.If the product have any problem, we provide the buyer within 15 days from receiving free replacement,Lifetime warranty,Please rest assured purchase
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