Description
Instructions for use
1. The DIP can be easily removed from the substrate without damaging the IC conductor. PLCC/PGA/PCLL/DIP wrapped IC can be unplugged from PCB or SOCKET.
2. With a handshake, the IC is pulled up vertically (not by force), so that the IC can be pulled out to obtain a complete PIN.
3. The IC of dense arrangement can be pulled out directly without moving other ics.
4. IC of different sizes within 5.5cm of contact surface can be pulled out in a very short time, simple operation and labor saving.
Note:
Before using this tool to repair the keyboard, it is necessary to use a soldering iron and a suction gun to remove the pinching tin.
Only then can you pull out the shaft body, otherwise it will pull out the solder joint or the line.
Specification
Material: stainless steel + plastic
Color: Black, green
Size: 102*54.6mm
Quantity: 1
Package includes: 1* Key extractor
1. The DIP can be easily removed from the substrate without damaging the IC conductor. PLCC/PGA/PCLL/DIP wrapped IC can be unplugged from PCB or SOCKET.
2. With a handshake, the IC is pulled up vertically (not by force), so that the IC can be pulled out to obtain a complete PIN.
3. The IC of dense arrangement can be pulled out directly without moving other ics.
4. IC of different sizes within 5.5cm of contact surface can be pulled out in a very short time, simple operation and labor saving.
Note:
Before using this tool to repair the keyboard, it is necessary to use a soldering iron and a suction gun to remove the pinching tin.
Only then can you pull out the shaft body, otherwise it will pull out the solder joint or the line.
Specification
Material: stainless steel + plastic
Color: Black, green
Size: 102*54.6mm
Quantity: 1
Package includes: 1* Key extractor